CC Texas Instruments RF Transceiver datasheet, inventory, & pricing. CC The CC is a low cost true single chip UHF transceiver designed for very low power wireless applications. The circuit is mainly intended for the ISM. Highly Integrated MultiCh RF Transceiver Designed for Low-Power Wireless Apps. Datasheet Texas Instruments CC
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The RF transceiver is integrated with a configurable baseband modem. This microcontroller, an ultra-low-power bit RISC mixed-signal processor, is ideal for low power and portable applications. If one inductor is placed so that dtaasheet has a very short straight trace, the other inductor will not fit in front of its corresponding pin.
Chapter III. WSN Schematic
The layer directly below the components should be a solid ground. Paperback – pages, 2nd edition November 2, Figure 5-Incorrect Figure 6 – Acceptable Figure 7 – Correct Importance of decoupling capacitors to each pin When using the reference design provided by TI, it is important to understand that each decoupling component is included for a reason.
Table of Contents 1. Paperback – pages January Each page is bytes wide. Second it provides a low pass filter. For more information on the MCP linear charge management controller, the datasheet can be found at Microchip.
For this reason, it is very important to keep the component spacing and traces as equal as possible. DS provides an absolutely unique identity.
In and ideal world, the components would be right next to each other without any traces required to connect them. The pin-for-pin and code compatible CC has better spurious response and improved close-in phase noise for adjacent channel performance. SSS Online is proud to present some tricks and hints on this important topic to help you design RF circuits that don’t fall prey to the harmonics, drop out and other bugaboos that can haunt the designer.
Some of the older data sheets still show the older designs, however, so RF engineers using this chip should be sure to download the most recent version from the TI website when beginning a new design.
In designing circuits using their components, Texas Instruments’ website provides very helpful documentation and design examples.
With a multi-layer board, the first inner layer can be a solid plane, which will accomplish this requirement rather easily.
A copy of the picture is reproduced below: With a two-layer design, it becomes more complicated to achieve a solid ground. The architecture, combined with five low power modes is optimized to achieve extended battery life. We typically pair it with the MSP microcontroller, a decision we made before TI’s acquisition of Chipcon and which works especially well now that both are manufactured by the same company.
This would allow for the traces to be of equal length and shape. The preferred method is to route bottom side traces on the opposite side of the CC from the RF outputs. This will cause the trace for the second inductor to be longer with more bending. If this is not possible, the trace should be routed directly below the device, but NOT under the RF pads or filter balun. The memory can be programmed 1 to bytes at a time, using the Page Program instruction.
In this case, if the width is wider than the component pads, the trace will have to be reduced just before entering the pad. Schematic of the WSN board. Hardcover – pages July With extensive capabilities for packet handling, data buffering, burst transmissions, clear channel assessment, and link quality indication, this chip is typically used with an on-board microcontroller.
What the picture does not show is how the supporting components should be placed and routed. However since that is not possible, the next best approach is to minimize the amount of inductance within the trace by making it as wide as possible based on the size of the component pads.
The balanced portion of the filter balun is very susceptible to variations between the two sections.
For more information on the CC microcontroller, the datasheet can be found at TI. The correct procedure is to route an individual trace from each pin to its associated capacitor. The digitally controlled oscillator DCO allows wake-up from low-power modes to active mode in less than 6ms.
Because the CC packaging has pins on all four sides, it can be difficult to connect things such as power. The current design has improvements to eliminate harmonic emission as well as variations based on power settings. Layout Resources from Pegasus Technologies. TI also continuously works to improve their reference designs. This will obviously make the layout a little more complicated, but extra effort will be appreciated when the circuit performs as expected without troubleshooting and modifications to the PCB.
The modem supports various modulation formats and has a configurable data rate of up to kBaud. As with the filter balun section, the ground plane below the trace must be solid up to the antenna.
Layout Resources on the Web. When pins are located next to each other and have a capacitor associated with each one, these components must be connected individually.
The complete file can be obtained from the worldsens web site.